As the industry marches toward 1,000-layer 3D NAND, new challenges emerge — slower etch rates, vertical profile issues, and greater scaling complexity. Through innovations in etch and deposition technology, like Lam Cryo™ 3.0, we overcome these obstacles and drive memory density to new heights. Read more in Counterpoint Technology Market Research's whitepaper. https://bit.ly/3WDsTVN | Lam Research Corporation
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As the industry marches toward 1,000-layer 3D NAND, new challenges emerge — slower etch rates, vertical profile issues, and greater scaling complexity. Through innovations in etch and deposition technology, like Lam Cryo™ 3.0, we overcome these obstacles and drive memory density to new heights. Read more in Counterpoint Technology Market Research's whitepaper. https://bit.ly/3WDsTVN | Lam Research Corporation
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Our proprietary etch technology suite — Akara® — supports the production of high-performance, high-density chips. Integrated on Lam’s high-productivity Sense.i® platform, Akara leverages Equipment Intelligence® solutions for automated maintenance to reduce overall equipment upkeep. Learn more. https://bit.ly/4i5iURo | Lam Research Corporation
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Our proprietary etch technology suite — Akara® — supports the production of high-performance, high-density chips. Integrated on Lam’s high-productivity Sense.i® platform, Akara leverages Equipment Intelligence® solutions for automated maintenance to reduce overall equipment upkeep. Learn more. https://bit.ly/4i5iURo | Lam Research Corporation
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For 20 years, our Kiyo® family of products has led the conductor etching industry, delivering high-performance capabilities and advanced chip designs with shrinking features.Learn how Akara®… | Lam Research
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For 20 years, our Kiyo® family of products has led the conductor etching industry, delivering high-performance capabilities and advanced chip designs with shrinking features.Learn how Akara®… | Lam Research
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Our cryogenic dielectric etch technology—Lam Cryo 3.0—delivers enhanced etch rates, vertical high aspect ratio (HAR) profiles, and more. Learn how Lam Cryo 3.0 is optimized to manufacture next-generation 3D NAND devices with 400 layers and beyond from Group VP and GM of Etch Product Group, Harmeet Singh. https://bit.ly/3yCkBVv | Lam Research Corporation
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Imagine a workspace where humans and robots work side by side, seamlessly enhancing productivity and safety in fabs. That is our vision with Dextro™, our collaborative robot (cobot) built for semiconductor manufacturing and equipment maintenance. Learn how our cobot helps chip makers meet surging demands for semiconductors and AI while driving ROI. https://bit.ly/3VAvJud | Lam Research Corporation
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Imagine a workspace where humans and robots work side by side, seamlessly enhancing productivity and safety in fabs. That is our vision with Dextro™, our collaborative robot (cobot) built for semiconductor manufacturing and equipment maintenance. Learn how our cobot helps chip makers meet surging demands for semiconductors and AI while driving ROI. https://bit.ly/3VAvJud | Lam Research Corporation
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When you're an engineer with Lam Research, you're creating solutions for our customers that have never been seen before! Thinking about a career with us? Check out our short video about what it's like to work in our engineering sector. | Lam Research Corporation
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When you're an engineer with Lam Research, you're creating solutions for our customers that have never been seen before! Thinking about a career with us? Check out our short video about what it's like to work in our engineering sector. | Lam Research Corporation
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"Seed layer: The thin film that starts it all" | Lam Research posted on the topic | LinkedIn
"Seed layer: The thin film that starts it all" | Lam Research posted on the topic | LinkedIn
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Our SEMulator3D® for virtual fabrication helps engineers predict and mitigate stress-related issues early in the process. See how our tool tracks stress evolution across each manufacturing step, allowing engineers to proactively optimize yield and performance. https://bit.ly/3ECeCCO | Lam Research Corporation
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Our cutting-edge advanced packaging technologies make High Bandwidth Memory (HBM) a reality for #GenAI devices. Discover why solutions like 2.5D and 3D integration are critical for enabling the third generation of HBM and providing high-speed access to vast data sets for #AI training. https://bit.ly/47ekrAC | Lam Research Corporation
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The semiconductor industry is bringing 3D advanced packaging concepts into production — are you ready? Discover how we ensure advanced packaging achieves commercial success. https://bit.ly/4dWuJYT | Lam Research Corporation
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Meet ALTUS® Halo | Lam Research | 12 comments
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We are proud to announce our new and improved website! Our site provides an interactive, informative platform for people to learn about our company and how we're disrupting the semiconductor equipment industry. Curious about our organization, products, career opportunities, and more? Visit our site: https://bit.ly/2aug63U | Lam Research Corporation
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Lam Research's Akara Features Breakthrough Innovation in Plasma Etch for the 3D Chipmaking Era
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At Lam Research, we’re pushing the boundaries of what's possible, enabling the technology that powers your world, and helping secure America’s place as a global tech leader. | Lam Research Corporation
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With the ever-increasing costs of semiconductor process development, we’re exploring ways to accelerate innovation without impacting performance or accuracy. In a controlled study, we used a virtual game to compare the performance of three process engineering models: ➖ Human engineers ➖ Computer algorithms with #AI ➖ A hybrid model leveraging both Here are the results. ⬇️ https://bit.ly/3MI4nxH | Lam Research Corporation
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At Lam Research, our Core Values guide who we are, what we do, and how we innovate and collaborate. Follow us on Facebook to discover more! | Lam Research Corporation
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As chips continue to shrink in size, the complexity and cost of semiconductor manufacturing increases. Today, we launched Coronus DX, the industry’s first bevel deposition solution optimized to address key challenges in advanced semiconductor manufacturing. Read for more. https://bit.ly/46b4OJg | Lam Research Corporation
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After 20 years of high-volume, tungsten-based atomic layer deposition, we’re equipping chipmakers with solutions set to power the future of AI. Learn how ALTUS® Halo technology helps enable molybdenum-based metallization for the development of next-generation DRAM and foundry logic devices. https://bit.ly/3FRnipp | Lam Research Corporation
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We're proud to introduce our winners of this year's Lam Thesis Award, which recognizes academic excellence in engineering, science and technology. In this video, some of our winners share their dreams and goals for the future, and discuss highlights from their trip to the US. Check it out! | Lam Research Corporation
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At Lam Research India, we strive to create a team-led environment that values every individual. Watch our short video to learn more about how we make this happen every day and to learn more about current opportunities click here: https://lamresearch.in/ | Lam Research Corporation
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So you think you’re a gearhead? Test your knowledge below! A semiconductor shortage, due to the demand for specialty technologies, triggered widespread production cutbacks in the automotive industry as car makers increasingly look to technology to boost the appeal of their products. Semiconductors drive which of these functions? Drop your best guess in the comments. a. Engine control b. Built-in cellular and Wi-Fi connections c. Climate control d. Park assist e. Collision avoidance f. Touch scre
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In 1987, our Concept One® PECVD system hit the semiconductor scene, igniting our tungsten deposition journey and raising the bar for manufacturing precision. Can you guess what else happened that same year? Toshiba introduced NAND flash memory — the tech behind the storage in countless devices we rely on today. Discover more milestones in our history. https://bit.ly/3IaVwpn | Lam Research Corporation
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