Xintec, Inc. engages in the provision of packaging services mainly in wafer level chip scale packaging (CSP), wafer level post passivation interconnection services (PPI), and wafer testing services.
Taiwan-based CIS and 3D sensor packaging specialist Xintec has expressed optimism about its sales performance in the third quarter of 2021, thanks to a seasonal pick-up in demand for 3D sensing ...
Taiwan Semiconductor Manufacturing, the world’s largest contract chip maker, plans to invest in specialty chip packaging company XinTec. XinTec makes a specialized glass-silicon sandwich package for ...
OpenAI CEO Sam Altman told some shareholders that the company is considering changing its governance structure to a for-profit business that the firm's nonprofit board doesn't control, The Information ...
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