The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

Assembly houses are fine-tuning their methodologies and processes for automotive ICs, optimizing everything from inspection and metrology to data management in order to prevent escapes and reduce the ...

Keysight Technologies, Inc. KEYS recently launched the Electrical Structural Tester (“EST”) to efficiently conduct wire bond inspection for semiconductor manufacturing. Designed for high-volume ...

MINNEAPOLIS--(BUSINESS WIRE)--Nordson Test & Inspection today announced that it has earned the Prime Award, which is the top honor, at the Step-by-Step Excellence Awards (SbSEA) for its groundbreaking ...