In particular, a new type of packaging defect phenomenon—die-pop—is observed. Vacuum reflow process has been able to reduce the solder void size to minimum value consistently but there is an ...

Optimizing speed and time are not only the ingredients to fulfill gold medal aspirations on the Olympic track, but the prerequisites to a robust surface mount (SMT) process of memory to bottom (logic) ...

Wilmington, MA. Rudolph Technologies at SEMICON West last week highlighted its new patented Clearfind technology, which can detect organic defects that are difficult or impossible to see with ...

Chiplets depend strongly on 2.5D and 3D packaging. In 2.5D systems dies are placed side-by-side on an interposer, while 3D ...