The MicroSense UltraMap-200C is an automated wafer metrology system designed for high throughput measurement of wafer thickness, flatness, bow and warp. The system features a proprietary dual probe ...
Modern semiconductor manufacturing technology has advanced rapidly. Because of this, measurement using non-contact displacement and transparent coating thickness has become very critical. Applications ...
HyperGauge In-plane Film Thickness Meter C17319-11 ©Hamamatsu Photonics Hamamatsu Photonics has developed the HyperGauge thickness measurement system C17319-11, a new device designed to enhance ...
A new instrument under development at the National Institute of Standards and Technology (NIST) uses infrared laser light to precisely measure the thickness of 300 millimeter silicon wafers. NIST ...
A new instrument under development at the US National Institute of Standards and Technology uses infrared laser light to precisely measure the thickness of 300 millimetre silicon wafers. In the last ...
Building semiconductors is an incredibly exacting process, with critical dimensions posing significant equipment challenges – and with the possibility that small process excursions can cause the yield ...
MILPITAS, Calif.--(BUSINESS WIRE)--KLA-Tencor (NASDAQ: KLAC) today released its next-generation in-situ plasma etch wafer temperature measurement product, the EtchTemp SensorWafer™. The newest ...
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