Using a wafer-level package (WLP) can reduce the overall size and cost of your solution. However when using a WLP IC, the printed circuit board (PCB) layout can become more complex and, if not ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

EETimes reports Solder pads could soon be made obsolete by a new nanotape material created by the Semiconductor Research Corporation (SRC) and Stanford University The researchers predict that early ...