Trends in next-generation battery packaging architectures. Optimizing packaging space with cell-connecting systems. Novel solutions for solving EMI, thermal management, and range-anxiety challenges.
In a recent article published in Molecules, researchers evaluated the synergistic effect of Aluminum Nitride (AlN) and Carbon Nanotubes (CNTs) on the properties of Silicon Rubber (SR) composites. The ...
The field of electronics, particularly integrated circuit (IC) technology, has advanced rapidly in recent years. With the development of 5G/6G mobile technology, semiconductor devices are evolving to ...
As demand for higher-performance, more compact and energy-efficient electronics continues to escalate, traditional organic based substrates are approaching practical limitations, leading to industry ...
Thermal management deals with problems arising from heat dissipation, thermal stresses and warping. It is critical in the packaging of power semiconductors and other microelectronic and optoelectronic ...
With the ever-increasing demand for higher performance and efficiency in electronic devices, the semiconductor industry is constantly pushing the boundaries of packaging technology. In the context of ...
CLEVELAND--(BUSINESS WIRE)--Ferro Corporation’s (NYSE: FOE) Electronic Materials business has expanded its low temperature co-fired ceramic (LTCC) portfolio, which includes industry-leading A6M and ...
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