For characterizing cold-plate and heat-sink cooling capacities, the HFC-100 heat flux controller measures and controls the heat within a cooling device to calculate its power dissipation. The system ...

Electronic devices, including those in telecommunications and high-power systems, generate heat during normal operation. That heat must be dissipated to avoid junction temperatures exceeding tolerable ...

Engineers face increasingly complex product requirements, making the need for thermal management tools and solutions paramount. Additive manufacturing and the ...

You knew it was coming. Liquid cooling is becoming mainstream and critical to addressing cloud-computing needs such as support for artificial intelligence (AI). This is needed not only for CPUs, GPUs, ...

As the heat density increases at the die level of more powerful semiconductor devices, there becomes a greater need for new and innovative cooling solutions. Standard Aluminum extrusions and bonded ...