A few years ago, we started to see researchers discussing an old manufacturing idea first explored in the 1980s: Wafer-scale processing. The idea of WSP is straightforward: Instead of dicing a wafer ...

Stacking chiplets vertically using short and direct wafer-to-wafer bonds can reduce signal delay to negligible levels, enabling smaller, thinner packages with faster memory/processor speeds and lower ...

Modern chips are manufactured on slabs of silicon less than a millimeter thick. But semiconductor companies try to slice these silicon wafers thinner and thinner to squeeze more performance out of ...